▌Capabilities for Rigid PCB (1)
Material Used:
FR-4、High Tg FR-405、FR-406、FR-408
Special Material:
Getek、GML 1000、Rogers/RO4003, 4350
Arlon、Teflon、Heavy Copper 3 oz
Maximum Panel Size:
21”× 24”( 530mm × 610mm )
Line width & Spacing:
Minimum Line Width (Internal) 4mil
Minimum Line Spacing (Internal) 4mil
Minimum Line Width (External) 4mil
Minimum Line Spacing (External) 4mil
Layer Count and Thickness:
Maximum Layer Count 16 Layer
Minimum Thickness (2 Layer) 12 mil
Minimum Thickness (4 Layer) 16 mil
Minimum Thickness (6 Layer) 18 mil
Maximum Thickness 197 mil |
▌Capabilities for Rigid PCB (2)
Layer to Layer Registration:±
5 mil
Min SMT Pitch:10
mil
Via/Drill Size:
Minimum Drill Hole Diameter 10 mil
Minimum Via Size 8 mil
Hole to Hole tolerance
± 3 mil
Hole to edge tolerance ± 4 mil
Micro Via
4 mil
Hole Aspect Ratio
1 :8
Solder Mask:Solder
mask Bridge Between solder dam
Solder mask Registration Tolerance
± 2 mil
Warpage:0.5
﹪
Impedance Control:± 10 ﹪Regular
Surface Finish:
Hard Gold/HASL/Peelable
mask/Carbon Ink /Immersion Gold/Tin/Silver/ENTEK. |
▌Capabilities for Flex PCB
Material Used:Polyimide
Maximum Panel Size:
10"×15.8"(250 mm × 400
mm)
Line width & Spacing:4
mil
Copper thickness:1/3
oz
Layer to Layer Registration
± 5 mil
Via/Drill Size:
Minimum drill Hole
Diameter 10 mil
Minimum Via Size 8 mil
Micro Via:4 mil
Surface Finish:
Hard Gold/Immersion Gold/HASL/Immersion Silver/Immersion
Tin/ENTEK
Coverlayer:
PI、Flexible Solder Mask
Stiffener material:PI、FR4 and Metal
Shielding material:Copper
/ Silver ink |